Low Emission Adhesive Technology

Dynea has developed a portfolio of low-emission wood adhesive systems that combine the performance of amino-based adhesives with reduced environmental impact. Available in the UK and Ireland through TS Resins, they are not classified under UK CLP regulations, making them well suited for interior and exterior applications where emissions need to be minimised.

The range includes adhesives for parquet flooring, form bending, solid wood lamination, foil bonding, and board-on-frame assembly. Suitable for a wide variety of wood species, they can be applied with rollers or string systems and are compatible with both hot press and radio frequency curing.

By lowering emissions without compromising bond strength, these low-emission wood adhesives help manufacturers in the UK and Ireland meet sustainability targets, regulatory requirements, and customer expectations for product quality.